Generating Representative Volume Element (RVE) for Finite Element Analysis of Random Fiber Composites/Nanocomposites

29 Jun 2017 | Contributor(s): Rajni Chahal, Ashfaq Adnan, Ajit Roy

      Typical electronics packages are assembled by integrating various parts on printed circuit boards (PCB). Traditional interconnect materials in electronics packages are not suitable for DoD electronics because in many DoD extremely transient conditions, mechanical failures of...