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  1. Constitutive modeling for time- and temperature-dependent behavior of composites

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    08 Jan 2020

    Structural integrity, durability, and thermal stability represent critical areas for adequately modeling the behavior of composite materials. Polymeric matrices are prone to have time-dependent behavior very sensitive to changes in temperature that influence the effective properties of the...

  2. MSC.Patran/Nastran-SwiftComp GUI

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    01 Apr 2019

    A graphical user interface (GUI) has been developed to integrate SwiftComp into MSC.Patran/Nastran for constitutive modeling and providing the automated conversion of the MSG plate and beam stiffness matrix into MSC.Nastran shell and beam element properties and materials. In order to reduce...

  3. VABS: Powering Simple Beam Elements with Detailed 3D FEA Fidelity

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    06 Jan 2017

    This presentation gives a brief introduction to VABS, a general-purpose cross-sectional analysis, which can power conventional, simple beam elements with detailed 3D FEA fidelity. 

  4. 2015 cdmHUB Workshop

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    05 Jan 2016 | Series

    Composites Design, Analysis and Manufacturing Workshop held at Purdue University on November 3-5, 2015.  Both lectures slides and lecture videos are presented.

  5. NAFEMS Invitation to Tender: How to Obtain Material Properties for Structural Analysis of Composites

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    13 Feb 2015 | White Papers/Research Documents

    The NAFEMS Composites Working Group wishes to commission a new document with the suggested title "How to Obtain Material Properties for Structural Analysis of Composites". The book will be a companion volume to the existing NAFEMS publications "An introduction to the use of material models in...

  6. 2013 Composites Design and Manufacturing HUB Kickoff Workshop

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    04 Sep 2014 | Series

    The Composites Design and Manufacturing HUB held a kick-off workshop at Purdue University on May 29-30, 2013 with over 100 attendees from industry, academia and government.  Select presentations from the workshop are included in this series.