Constitutive modeling for time- and temperature-dependent behavior of composites
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08 Jan 2020 | Contributor(s): Orzuri Rique, Xin Liu, Wenbin Yu, Byron Pipes
Structural integrity, durability, and thermal stability represent critical areas for adequately modeling the behavior of composite materials. Polymeric matrices are prone to have time-dependent behavior very sensitive to changes in temperature that influence the effective properties of the...
Initial failure strength prediction of woven composites using a new yarn failure criterion constructed by deep learning
05 Jun 2019 | Contributor(s): Xin Liu, Federico Gasco, Johnathan Goodsell, Wenbin Yu
A new failure criterion for fiber tows (i.e. yarns) is developed based on a micromechanical model using mechanics of structure genome (MSG) and deep learning neural network. The proposed failure criterion can be applied to yarns in mesoscale textile composites modeling while capturing the failure...
01 Apr 2019 | Contributor(s): Xin Liu, Wenbin Yu
A graphical user interface (GUI) has been developed to integrate SwiftComp into MSC.Patran/Nastran for constitutive modeling and providing the automated conversion of the MSG plate and beam stiffness matrix into MSC.Nastran shell and beam element properties and materials. In order to reduce...
A Unified Approach for Thermoelastic Constitutive Modeling of Composite Structures
07 Feb 2019 | Contributor(s): Xin Liu, Wenbin Yu, Federico Gasco, Johnathan Goodsell
Mechanics of structure genome (MSG) has been extended to provide a unified approach to predict the thermoelastic behaviors of composite structures. The variational statement of the MSG models has been modified to capture pointwise temperature distribution in composite structures. The effective...
Multiscale analysis of multilayer printed circuit board using Mechanics of Structure Genome
23 Jan 2019 | Contributor(s): Fei Tao, Xiuqi Lyu, Xin Liu, Wenbin Yu
The structure of Printed Circuit board (PCB) is very complicated because it consists of woven composites and custom defined conducting layers. To improve the reliability of PCB, it is critical to predict the constitutive relations accurately. This study by implementing Mechanics of Structure...
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