Multiscale analysis of multilayer printed circuit board using Mechanics of Structure Genome

By Fei Tao¹, Xiuqi Lyu¹, Xin Liu¹, Wenbin Yu¹

1. Purdue University

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Supporting Docs

• (PDF, 4.61 MB) Multiscale_analysis_of_multilayer_printed_circuit_board_using_Mechanics_of_Structure_Genome.pdf
• (7Z, 4.76 MB) Woven_Homogenization__Integration.7z
• (PY, 3.60 KB) 1080.py