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With respect to material design, in particular, smart material design with specific functionalities, we may be able to learn something from our peers in electrical engineering. In integrated circuits (IC), we have up to one billion basic units such as capacitors, inductors, and resistors. However, we know exactly where they are and what they do. How does this happen? Because our electrical engineers package a group of basic components into modules such as op-amps and filters. The planar design of layers pioneered by Robert Noyce is the foundation for information technology. Similar modular principles in electrical engineering might be what we need for modern material design. We should package material units with different functionalities and apply these units directly for structural design or the construction of material units at larger scales.
About the author
Sheldon X. Wang
Dr. Sheldon Wang is a tenured full professor of the McCoy School of Engineering at the Midwestern State University. Dr. Wang has been teaching in higher education for over twenty years. He received his B.S. degree in Applied Mechanics in 1988 from Shanghai Jiao Tong University, and M.S. and Ph.D. degrees in Applied Mechanics from MIT in 1993 and 1995. Subsequently, he has worked in the Institute of Paper Science and Technology (currently part of GaTech), Polytechnic University (currently part of NYU), and New Jersey Institute of Technology as a faculty member before joining MSU in 2009. In 2002, Dr. Wang was selected by Polytechnic University as one of the five founding Othmer Junior Faculty Fellows. He was also selected as the ASEE Air Force Summer Faculty Fellow in 2008 and 2009. His research interests include computational fluid and solid mechanics, fluid-solid interactions, quantitative modeling of biological systems, dynamical systems, and complex systems. Dr. Wang is the author of over 30 journal papers with more than eight hundred and forty journal citations and an h-index 15. He is also the author of a research monograph “Fundamentals of Fluid-Solid Interactions – Analytical and Computational Approaches” published by Elsevier Science in 2008. This book is available in nearly three hundred libraries around the world. Dr. Wang has served in the editorial board of Computers & Structures and a number of international conferences on computational mechanics as well as reviewers for National Science Foundation, US Department of Agriculture, and other governmental agencies. Dr. Wang also served as the Chair of the Mechanical Engineering Tuning Committee in Texas Higher Education Coordinating Board (THECB) from 2010 to 2012.
Wenbin Yu @ on — Edited @ on
Dear Sheldon, This is an excellent point and my recent work on mechanics of structure genome (MSG) might provide a good foundation for this. Please refer to http://imechanica.org/node/18928 for a detailed description of my idea on MSG.
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